Panduit®
Panduit
GB2B0304TPI-1 StructuredGround Flat Grounding Busbar, 10 in L x 2 in W, 600 V AC, Copper
- MFR #:
- GB2B0304TPI-1
- UPC:
- 074983659265
- Item #:
- 491720
Panduit®
Panduit
GB2B0304TPI-1 StructuredGround Flat Grounding Busbar, 10 in L x 2 in W, 600 V AC, Copper
- MFR #:
- GB2B0304TPI-1
- UPC:
- 074983659265
- Item #:
- 491720
Product Details
Panduit® StructuredGround™ Grounding Busbar, Flat, 2 in Bar Width, 10 in Bar Length, 600 V AC, Copper, TiN Coated
Manuals & Documentation
Features
- Made of high conductivity copper and tin plated to inhibit corrosion
- Pre-assembled with brackets and insulators attached for quick installation
- GB2B0304TPI-1 comes pre-assembled with brackets and insulators attached for a quick installation
- The insulators provide 600 V of insulation and use of Panduit® self-laminating laser/ink jet labels to identify busbars
- Made of high conductivity copper and tin plated to inhibit corrosion
- Come pre-assembled with brackets and insulators attached for quick installation
- Use Panduit® component labels, sold separately, to identify busbars to meet TIA/EIA-606-A
Specifications
Identifiers
| Manufacturer Part Number |
GB2B0304TPI-1
|
|---|---|
| GTIN |
00074983659265
|
| UPC |
074983659265
|
|---|---|
| EAN |
0074983659265
|
General Information
| Manufacturer |
Panduit
|
|---|---|
| Brand |
Panduit®
|
| Country Of Origin |
US
|
| Standards Approvals |
BICSI/TIA-607-D, cULus Listed for Grounding and Bonding Equipment | ARRA Compliant | BICSI Specified | Buy American Act Compliant | cULus Listed | J-STD-607-A | RoHS Compliant | TIA-607-B/TIA-607-C
|
|---|---|
| Application |
Telecom, Data Center Applications
|
Technical Information
| Bar Length |
10 in
|
|---|---|
| Bar Thickness |
6.4 mm
|
| Bar Width |
2 in
|
| Finish |
TiN Coated
|
| Hole Diameter |
1/4 in, 3/8 in, 5/16 in, 7/16 in
|
| Material |
Copper
|
|---|---|
| Number Of Holes |
14
|
| Type |
Flat
|
| Voltage Rating |
600 V AC
|